Abstract
An improved ferrite ion etching technique and the characteristics of magnetic heads fabricated by this technique are reported. To improve the read/write characteristics of the head fabricated by ion etching, the optimum conditions have been investigated, under which the maximum etching rate ratio between ferrite sample and metal mask can be obtained. As a result, it has become possible to realize etching grooves deeper than 10 μm by sputter etching using a thin, high definition Ti or Al mask laminated with Cr. Using this improved ion etching technique, narrow track width magnetic heads can be fabricated with tolerances within ±1 μm and improved yield rate.
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