Abstract
Lenticular lenses are widely used in the three-dimensional display industry. Conventional lenticular lens components are made of plastics that have low thermal stability. An alternative is to use glass to replace plastic as the lenticular lens component material. Single crystal silicon is often used as the mold material in the precision glass molding process. It is, however, difficult to fabricate a lenticular lens silicon mold that has a large feature size compared to the critical depth of cut of silicon. In order to solve the problems of machining lenticular lens silicon molds using the conventional diamond cutting method, such as low machining efficiency and severe tool wear, a hybrid machining method that combined laser ablation and diamond cutting was proposed. A feasibility study was performed to investigate the possibility of using this method to fabricate a lenticular lens silicon mold. The influence of the laser parameters and machining parameters on the machining performance was investigated systematically. The experimental results indicated that this hybrid machining method could be a possible method for manufacturing lenticular lens silicon molds or other similar microstructures.
Highlights
Autostereoscopic display technology is a glass-free, three-dimensional (3D) technology that allows people to acquire a 3D perception of images without wearing specialized headgear or glasses
For the lenticular lens type, the 3D effect is realized by the refraction function of lenticular lenses, which can deliver different images to the right and left eyes separately
The reliability of this kind of display is low because the thermal expansion between the lenticular lens and the liquid crystal display (LCD) panel is different, causing a location shift between them [2]
Summary
Autostereoscopic display technology is a glass-free, three-dimensional (3D) technology that allows people to acquire a 3D perception of images without wearing specialized headgear or glasses. Silicon is a brittle material that is relatively difficult to cut using a diamond tool because cracks are formed on the machined surfaces during the cutting process [6,7]. This means that generating this kind of microstructure on a silicon workpiece surface with the ductile region machining method will have extremely low efficiency.
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