Machine Learning (ML) Based Thermal Management for Cooling of Electronics Chips by Utilizing Thermal Energy Storage (TES) in Packaging That Leverages Phase Change Materials (PCM)

Abstract

Miniaturization of electronics devices is often limited by the concomitant high heat fluxes (cooling load) and maldistribution of temperature profiles (hot spots). Thermal energy storage (TES) platforms providing supplemental cooling can be a cost-effective solution, that often leverages phase change materials (PCM). Although salt hydrates provide higher storage capacities and power ratings (as compared to that of the organic PCMs), they suffer from reliability issues (e.g., supercooling). “Cold Finger Technique (CFT)” can obviate supercooling by maintaining a small mass fraction of the PCM in a solid state for enabling spontaneous nucleation. Optimization of CFT necessitates real-time forecasting of the transient values of the melt-fraction. In this study, the artificial neural network (ANN) is explored for real-time prediction of the time remaining to reach a target value of melt-fraction based on the prior history of the spatial distribution of the surface temperature transients. Two different approaches were explored for training the ANN model, using: (1) transient PCM-temperature data; or (2) transient surface-temperature data. When deployed in a heat sink that leverages PCM-based passive thermal management systems for cooling electronic chips and packages, this maverick approach (using the second method) affords cheaper costs, better sustainability, higher reliability, and resilience. The error in prediction varies during the melting process. During the final stages of the melting cycle, the errors in the predicted values are ~5% of the total time-scale of the PCM melting experiments.