Abstract
New planar transmission lines employing multilayer structures are examined for possible applications in microwave and millimeter-wave integrated circuits. Detailed investigations are presented through numerical results calculated using the spectral domain technique. The newly proposed transmission lines have many attractive features such as large impedance ranges, flexibility and the ability to realize complicated, densely packed integrated circuits, as well as miniaturization through the use of thin dielectric layers.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
