Abstract
Silicon waferboard technology based on etched and deposited passive-alignment features has been applied to the fabrication of optoelectronic transmitter and receiver arrays for rf applications. Using silicon waferboards, we have aligned both 1 by 4 buried-heterostructure laser arrays and 1 by 4 PIN photodetector arrays to optical fiber ribbons. Besides serving as mechanical carriers and alignment guides, the silicon wafers can also be used as rf or microwave substrates. We introduce rf-optoelectronic receiver arrays based on such enhanced silicon waferboards.
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