Abstract
Next Generation Lithography (NGL) technologies require masks that are significantly different from each other and from conventional photomasks but possess many similarities and processing challenges. The Next Generation Lithography Mask Center of Competency (NGL-MCOC) was formed to identify these process issues and potential areas for commonality and eventually provide a commercialization path for NGL masks. The NGL-MCOC consists of a partnership between Photronics and IBM. The IBM advanced mask facility is applying the technology developed for x-ray masks to other NGL technologies, and Photronics is supplying the organization and eventual commercialization of the technology. To broadly address NGL mask issues, the NGL-MCOC has collaborated with the NGL industry champions. Mask blanks have been written for SCALPEL./eLith, EUV-LLC, and Infineon/IPL. By utilizing common patterns and as much common processing as possible, rapid process development and efficient comparison of the mask issues with the different NGL technologies is quickly achieved. In addition, the NGL-MCOC has fabricated mask blanks for SCALPEL and stencil to evaluate new materials and process options.
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