Abstract
Ceramic sensor based on TiO<SUB>2</SUB>-Al<SUB>2</SUB>O<SUB>3</SUB> systems were thermally cycled in the temperature range of 21 degree(s)C to 685 degree(s)C for different number of cycles. Thermal wave imaging technique (TWI), a non-destructive and non-contact evaluation method was used to characterize the bonding of sensor films with the substrate. Based on the thermal wave signal amplitudes, an assessment of bond strength was made. The results indicate that samples with 700 degree(s)C heat treatment show the best bonding characteristics. Furthermore, with increasing number of thermal cycles, bonding quality turns out to decrease as damage occurs. Thermal wave imaging is a powerful NDE tool. Results from a number of material evaluation efforts indicate that the technique has great promise.
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