Abstract
The Micro Materials Center Berlin (MMCB) located at the Fraunhofer Institute IZM belongs to three German Centers for Materials Research in Microtechnology funded by the German Ministry for Education and Research (BMBF). The paper presents some recent results obtained in the field of electronic packaging for MEMS. A survey is given concerning advanced interconnection technologies (chip size packaging, BGA, wafer level packaging etc.) taking into account new developments in the field of materials research for packaging in various applications, e.g. in automotive and telecommunication systems. Special attention will be given to overcome the reliability gap which can be found in the field of microsystem reliability (e.g. high temperature electronics, lead-free solder applications in MEMS etc.). The authors present recent results obtained in the different branch labs of MMCB situated in Berlin, Munich, Chemnitz, Oberpfaffenhofen, and Teltow. New fields of applications are dealt with e.g. polytronics, micromechatronics.
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