Abstract

The application of Quad Flat Pack (QFP) and Ball Grid Array (BGA) technology in manufacturing of advanced electronic products has been grown significantly during the past several years. QFP and BGA has several advantages over traditional packaging technology in terms of smaller package area, higher I/Os, higher assembly yield, and so on. However, some potential problems of bridge among solder joints in QFP and creep-fatigue failure of solder joints in BGA serving occurs and often results in the failure of products. It has been found that both the bridge in QFP and fatigue failure of solder joints in BGA highly depends on the shape of solder joints. So, in this paper, the mathematical models of simulating the formation of solder joints in QFP and BGA are built based on minimum energy theorem, and the shape of solder joints are predicted. According to the predicted shape, the bridge mechanism in solder joints in QFP and the fatigue failure of solder joints in BGA is investigated.© (2000) COPYRIGHT SPIE--The International Society for Optical Engineering. Downloading of the abstract is permitted for personal use only.

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