Abstract
The problem of deep ultraviolet (DUV) resist footing on titanium nitride (TiN) substrates has been studied using three different photoresists and TiN films of various stoichiometries. Multiple characterization techniques have been used to characterize the TiN films including auger electron spectroscopy, atomic force microscopy, Rutherford backscattering and reflectivity measurements. Resist footing was compared for process delay experiments, softbake temperature changes, and pretreatments to the TiN substrates. Based on these results and information previously published, it is concluded that detrimental surface and interface states exist on the TiN substrate which are principally reasonable for the footing.
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