Abstract
In this study, a new experimental system, which integrated Holographic Interferometry (HI) with Moire Interferometry (MI), was developed for thermal deformation measurement in a ball grad array (BGA) assembly caused by power cycles. In the experiments MI was used for the in-plane measurement, and HI was used for the out-of-plane measurement, and furthermore, MI and HI were simultaneously operated. Therefore, it provided whole-field displacement information including the in-plane and the out-of- plane deformations with high sensitivity and resolution. The results showed that the in-plane expansion of the PCB was larger than that on the CBGA, and the PCB and the CBGA bended with different curvature. The corners of the CBGA were high strain concentration areas. The crucial techniques for thermal deformation measurement using the HI/HI system and typical experimental results for the CBGA-PCB assembly are described, and also, the reliability of solder balls of CBGA is discussed based on the measurements of the in-plane and the out-of-plane deformations.
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