Abstract

We present a new geometry for edge-pumping of a solid-state microchip laser. This design, which consists of a thin-disk gain crystal surrounded by a diffusion bonded undoped material that guides the pump light, allows a good thermal heat management by reducing the thickness of the gain media, whereas the pump optics is kept simple. The upper surface of the gain media has concave-spherical shape that allows easy confinement of the pumping power to laser gain media thinner than 100 μm. Simulations show that more than 0.95 of the pump radiation with uniformity coefficient in excess of 0.96 can be absorbed in an Yb:YAG/YAG composite device that has a 50-μm thick, 10-at.% Yb:YAG of 3 mm diameter.

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