Abstract
Holographic exposure and selective etching in silicon are combined to fabricate high-precision gratings with nearly arbitrary blaze angle and flat surfaces. The process starts with commercially available silicon wafers, the surfaces of which are oriented at the desired angle to a {1 1 1} plane. Gratings between 0.5μm and 5 μm have been realized with holographic and mask exposure. Efficiencies up to 90% have been measured. Furthermore, simple tools for quick and high-precision alignment of the holographic equipment are described.
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