Abstract
The in situ observations of solidincation and melting of an aluminum-silicon alloy (Al -12.6%Si) using an ultrasonic waveguide sensor are presented. The ultrasonic sensor consists of a conventional piezoelectric ultrasonic transducer, a cooling system and a titanium (Ti) rod as an ultrasonic waveguide. The sustainability of the Ti rod in the molten Al alloy is investigated by immersiontests for 1, 4, 8 and 16h at 800' C. The formation of a layer consisting of globular TiAl 3 , disperse AlSi 2 Ti and α-Al phases has been observed at the interface between the Ti and the Al alloy. Ultrasonic pulse-echo measurements of the Al alloy during solidification and melting have been performed using the ultrasonic sensor in temperature range from 200 to 800°C. The longitudinal wave velocity of the Al alloy shows a rapid and significant change from about 3900 to 5600 m/s around the eutectic point, An attempt to measure a solid/liquid interface of the Al alloy has been made at frequency of 2.25 MHz. The reflected echo from the interface undergoing directional solidification has been observed. The position and growth rate of the interface have also been determined from the reflected echo.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
