Abstract
In this paper, the optimization of ohmic contacts for semiconductor lasers based on InGaAs/GaAs/GaAlAs layers is reported. Transmission electron microscopy (TEM) and electrical methods were used to study extensively the Pt/Ti/Pt/Au metallization system. The contact fabrication technology was optimized towards achieving the lowest electrical resistance. The technological control and optimization concerned the contact annealing temperature and thickness of metallic layers that form the contact. The average specific contact resistance was below 5×10 −6 Ω cm 2 (with the record value of 8×10 −7 Ω cm 2) for the 10 nm Pt/20 nm Ti/30 nm Pt/150 nm Au system. The presented system was used in fabrication of continuous wave (CW) operated laser diodes. The chips mounted on passively cooled copper block achieved optical powers over 1 W, threshold current density values of 140–160 A/cm 2 and differential efficiencies above 1 W/A. The value of the characteristic temperature T 0 for discussed lasers varied in the range of 180–200 K.
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