Abstract

In high performance computer systems and large-scale data centers, data movement becomes a critical problem. To overcome this problem, we have studied an optical connector and an optical/electrical hybrid package substrate for a single-mode co-packaged optics of LSI packages. To realize low-cost self-aligned assembling of the optical connector on the hybrid package substrate, we proposed unique alignment structures which can be fabricated precisely with low-cost mass-productive processes. Using the proposed technique, the alignment structures were fabricated in precise position without any long-tact-time high-cost alignment processes. We fabricated the optical connector and the hybrid package substrate and demonstrated the self-aligned assembling process. We successfully assembled the optical connector to the waveguide-integrated package substrate with an error of 1.57-micrometers. Considering the obtained alignment error, low loss optical coupling with 0.5-dB misalignment loss was expected.

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