Low-Cost Micro-Optical Modules for Datacommunication to Optical Interconnections from the LAN-to the PCB-Level

Abstract

One of the grand challenges in solving the interconnection bottlenecks at the printed circuit board (PCB) and multi-chip-module (MCM) level, is to adequately replace the PCB and intra-MCM galvanic interconnects with high-performance, low-cost, compact and reliable micro-photonic alternatives. Therefore we address the following components in this paper: 1) out-of-plane couplers for optical waveguides embedded in PCB, 2) peripheral fiber ribbons and two-dimensional single- and multimode fiber connectors for high-speed parallel optical connections, and 3) intra-MCM level optical interconnections via free-space optical modules. For the fabrication of these micro-optical interconnect modules, we are focusing at the Vrije Universiteit Brussel on the continuous development of a rapid prototyping technology, which we call deep proton writing (DPW). The special feature of this prototyping technology is that it is compatible with commercial low-cost mass replication techniques such as micro injection moulding and hot embossing.