Abstract

We have demonstrated that photo-thin film transistors (photo-TFTs) fabricated via a simple defect-generating process could achieve fast recovery, a high signal to noise (S/N) ratio, and high sensitivity. The photo-TFTs are inverted-staggered bottom-gate type indium-gallium-zinc-oxide (IGZO) TFTs fabricated using atomic layer deposition (ALD)-derived Al2O3 gate insulators. The surfaces of the Al2O3 gate insulators are damaged by ion bombardment during the deposition of the IGZO channel layers by sputtering and the damage results in the hysteresis behavior of the photo-TFTs. The hysteresis loops broaden as the deposition power density increases. This implies that we can easily control the amount of the interface trap sites and/or trap sites in the gate insulator near the interface. The photo-TFTs with large hysteresis-related defects have high S/N ratio and fast recovery in spite of the low operation voltages including a drain voltage of 1 V, positive gate bias pulse voltage of 3 V, and gate voltage pulse width of 3 V (0 to 3 V). In addition, through the hysteresis-related defect-generating process, we have achieved a high responsivity since the bulk defects that can be photo-excited and eject electrons also increase with increasing deposition power density.

Highlights

  • We have demonstrated that photo-thin film transistors fabricated via a simple defectgenerating process could achieve fast recovery, a high signal to noise (S/N) ratio, and high sensitivity

  • Chen et al proposed the positive gate bias pulse voltage (PBP)-driven persistent photocurrent (PPC)-free photo-TFTs with unannealed IGZO single-channel layers, which were operated at a wide VG pulse width of 10 V (0 to 10 V)[16]

  • We demonstrated that the surface of the atomic layer deposition (ALD)-derived Al2O3 gate insulator was damaged by ion bombardment during the IGZO sputter deposition process

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Summary

Introduction

We have demonstrated that photo-thin film transistors (photo-TFTs) fabricated via a simple defectgenerating process could achieve fast recovery, a high signal to noise (S/N) ratio, and high sensitivity. The removal of the PPC by the PBP was ascribed only to PBP-accelerated recombination events between oxygen vacancies and excess electrons in the bulk semiconductor since the PPC dominantly originated from the bulk IZO layers in IGZO/IZO or IGZO/ IZO/IGZO multi-channel layers These PPC-free photo-TFTs adopted additional processes for fabricating dual gate or multi-channel structures. Chen et al proposed the PBP-driven PPC-free photo-TFTs with unannealed IGZO single-channel layers, which were operated at a wide VG pulse width of 10 V (0 to 10 V)[16] They used a large amount of natural defects within the unannealed IGZO or at the IGZO/gate insulator interface that act as electron traps to erase the PPC16. The fabrication of PPC-free photo-TFTs with simple- and uniform-channel layers is an issue to have to be solved

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