Low temperature tensile behavior and microstructure analysis of copper containing antibacterial stainless steel

Abstract

Using Shimadzu AGS-100KN universal tensile testing machine, tensile tests were conducted on copper containing antibacterial stainless steel at 25 °C, −20 °C, −60 °C, −100 °C, and −140 °C. The fracture morphology and microstructure evolution of the material were then analyzed using various techniques including scanning electron microscopy (SEM), electron backscatter diffraction (EBSD), X-ray diffraction (XRD), and transmission electron microscopy (TEM) techniques. The experimental findings showed that with the decrease of deformation temperature, the ultimate tensile strength(UTS) increased by about 49.7 %, the yield strength (YS) increased by about 35.5 %, and the elongation(EI) decreased by about 27.3 %, showed obvious low temperature strengthening effect. The High-angle grain boundaries (HAGBs) increased with decreasing temperature, while low-angle grain boundaries (LAGBs) decreased. The plasticity gradually decreased and the strength gradually increased, resulting in an increase in its ability to resist deformation. The number of precipitated phases gradually increased, and the size also gradually becomes larger, and the interaction between the diffusely distributed precipitated phases and dislocations led to precipitation strengthening. With the decrease of temperature, the stacking fault energy gradually decreased, the SFE was 21.26 mJ/m2 at the temperature of −140 °C. The main plastic deformation mechanism of copper-containing austenitic stainless steel in the low-temperature tensile process was transformed from deformation twins to strain-induced martensitic phase transformation.