Abstract
Ultralow-temperature sintering plays a vital role in the development of flexible printed electronics, which improves flexibility and reduces energy consumption. This study investigates the ultralow-temperature sintering of large-sized silver nanoparticles (Ag NPs) by laser modification of the substrate surface. Ag NPs in conductive ink were sintered at only 60 °C. Designing the appropriate size of modified regions, the sintered Ag layer exhibits a sheet resistance of only 0.274 Ω and withstands 10 000 folding cycles. Energy-dispersive x-ray spectroscopy showed that TiO2 formed by laser ablation promotes the sintering of Ag NPs and joining with the substrate. A paper-based flexible integrated circuit board was also prepared.
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