Low-temperature-sintering and characterization of glass-ceramic composites

Abstract

To meet the demands of high power and high-speed propagation of the signal for very large scale integration, a series of glass/ceramic composites were prepared using electronic ceramics process from borosilicate glass with Sr-celsian, which contains 30, 40, 50, 60, 70 wt% ceramic. The phase and microstructural evolution of the composites were characterized by XRD and SEM. The properties of the composites were also measured. Results show that the thermal expansion coefficient, dielectric constant and hardness of the composites increase with an increase content of Sr-celsian. However, the dielectric loss decreases with increasing Sr-celsian content. For the composites with ≧ 60 wt% Sr-celsian fired at 850–900°C, formation of α-quartz and cristobalite in the composites during the sintering process has bad effect on thermal expansion, but has little effect on the values of dielectric properties of the composites. The obtained composites exhibit low dielectric constant (5.2–5.8), low dielectric loss (⩽ 0.25%), low thermal expansion coefficient (4.4–6.2 × 10−6°C−1) and low-temperature sintering behavior (⩽900 °C), which suit for electronic packaging field.