Abstract
The low temperature sealing of Kovar alloy to DM305 electronic glass was realized by using lead-free glass solder of the Bi2O3-ZnO-B2O3 system in atmospheric environment. The sealing process was optimized by pre-oxidation of Kovar alloy and low temperature founding of flake glass solder. The effects of sealing temperature and holding time on the properties of sealing joint were studied by means of X-ray diffraction (XRD), scanning electron microscope (SEM), energy dispersive X-ray spectroscopy (EDS), etc. The results showed that the pre-oxidized Kovar alloy and DM305 electronic glass were successfully sealed with flake glass solder at the sealing temperature of 500 °C for 20 min. Meanwhile, the joint interface had no pores, cracks, and other defects, the shear strength was 12.24 MPa, and the leakage rate of air tightness was 8 × 10−9 Pa·m3/s. During the sealing process, element Bi in glass solder diffused into the oxide layer of Kovar alloy and DM305 electronic glass about 1 μm, respectively.
Highlights
Glass materials have good light transmittance, insulation, and corrosion resistance, and many new applications and manufacturing processes will involve glass in combination with other materials [1].Metal materials have good electrical conductivity, thermal conductivity, and plastic toughness.The comprehensive properties of glass and metal can be utilized through the combination of glass and metal
A glass brazing material needs to be employed to seal between glass tube and metal pipe to achieve a certain degree of vacuum for parabolic trough receivers [5,6,7,8], and glass to metal sealing plays a key role and can prevent the leakage of fuel and air in planar solid oxide fuel cells (SOFCs) [9,10,11]
Kovar alloy is a Fe-Ni-Co alloy with Fe as the main matrix element, and its expansion coefficient is similar to that of silicon-boron hard glass; Kovar alloy and glass sealing are widely used in the field of electronic packaging related to in-candescent lamps, electron tubes, and housing for semi-conductors [12]
Summary
Glass materials have good light transmittance, insulation, and corrosion resistance, and many new applications and manufacturing processes will involve glass in combination with other materials [1]. Aluminum metal matrix composites possess excellent performance such as light-weight, good thermal conductivity, and adjustable linear coefficient of thermal expansion, making them the first choice of the new generation electronic packaging materials [3,14,15]. Aluminum metal matrix difficult to completely replace the traditional. Kovar alloy with aluminum metal matrix composites in a composites in a short period of time. Thedesigned use of a combination of aluminum metal matrix composites composites and alloy can be to achieve weight reduction of the packaging shell,and as. T/Rglass module sealing terminal, component of electronic packaging shell and glass terminal, part of and insulation a part of 65% SiC p/Al-MMCs is utilized toinsulation replace Kovar alloy,awhich. Li–Tisuccessfully ferrite, and combined other materials usingaluminum lead-free glass solder [20,21,22,23,24]
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