Low-temperature reliability enhancement of system-in-package with silicon-based resistors and its electrothermal analysis

Abstract

System-in-Package (SiP) is one of the mainstream developments of the integrated circuit industry, whose instability in low-temperature environments restricts its evolution and application. In this study, we propose a reinforcement scheme using silicon-based resistors to overcome the electric reliability issue of SiP under temperatures ranging from −70 °C to −50 °C. By arranging resistors around the SiP substrate to act as thermal engines and controlling their time-varying excitation voltages, the SiP's temperature can be stabilized under different backgrounds, resulting in stable performance that is insensitive to temperature variations. To assess the proposed design precisely, we improve the electrothermal simulation by incorporating the temperature-dependent material characterizations and iteratively calculating the heat transfer coefficient, thereby elevating the accuracy of this multi-physics method. Our three-dimensional simulation and experiment results validate the reliability enhancement of the design and the efficacy of the simulation improvement.