Abstract

A polycrystalline-silicon (poly-Si) thin-film transistor (TFT) deposited at low temperature on Corning 7059 glass is reported. It has practical applications for low-cost thin-film display and imaging electronics manufacturing. All the process steps used to fabricate the poly-Si device take place at temperatures of 550 degrees C or less. The poly-Si films exhibit crystallite grain sizes on the order of 5000 AA, and the fabricated devices show field-effect mobilities of 10-20 cm/sup 2//V-s and threshold voltages around zero. A plasma process to form the source and drain contacts has also been developed.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>

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