Abstract
Low temperature metal-organic chemical vapor deposition (MOCVD) process of Ru films for use as electrode material was studied using a noble dome type reactor, liquid delivery technique and a new precursor. The films were grown at temperatures ranging from 275°C to 480°C in which film growth was controlled by a surface chemical reaction with a small activation energy of 0.21 eV. The root-mean-squared surface roughness was as low as 23 Å for a film grown at 290°C on a SiO2 surface.
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