Low-Temperature Joining of B4C Ceramics Using Cold-Sprayed Al-8wt%Si Alloy and Microstructure of the Vicinity of the Joint Interface

Abstract

A series of studies were conducted to demonstrate the feasibility of low-temperature bonding by the forming and heating an Al-8wt%Si alloy thick film on a B4C surface by cold spraying. The results show that: (1) The cracks near the joining interface are closed by the Al alloy by the process studied in this study, and a joining strength of about 220 and 240 MPa is achieved by low temperature joining of 580 °C and 600 °C, respectively.; (2) The amount of weak intermetallic compounds at the joining interface is reduced; (3) It is assumed that the reduction in the amount of Al-B-C compounds is due to the formation of the β phase during the solidification process of the Al-Si alloy, which hinders the growth of the compounds.; (4) On the primary joint surface, a continuous void group is formed in the vicinity of the β phase that surrounds the α phase, causing a decrease in the joining strength.