Abstract
Abstract The technique of back-scattering MeV helium ions has been applied to the study of the interdiffusion behaviour of bimetallic Cu-Au thin films. The films were annealed for up to 210 min at 170°–300°C. A rapid initial mixing was detected for all the temperatures investigated and was attributed to the large density of structural defects present in an evaporated film. The plateaus exhibited in the copper and gold energy spectra suggest the appearance of CuAu3 as a first phase and then of CuAu and Cu3Au phases. The interdiffusion coefficient was measured from the gold concentration profiles for gold atomic concentrations in the range 25-0% and a value of 2.5 × 10-15 cm2/sec at 220°C was obtained. An activation energy of 1.4 eV was estimated for this process.
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