Abstract
High current density and high temperature gradient are major reliability concern for next generation nanoelectronic packaging and power electronics. High current density experiments on lead free solder joints coated with NiAu and non-coated Cu pads were conducted at −20, −30, −40 and −50 °C ambient temperatures. The time to failure (TTF) shows that solder joints with NiAu coated Cu pads last longer. Results also indicates TTF plot shows that TTF rate increases exponentially when the solder joint temperature is higher than 64% of its melting temperature, and decreases exponentially reaching the maximum lifetime when the temperature is below this threshold temperature. The mass transport activation energy, E a was determined using the test data and it was found to be 2.67 ± 0.05 and 3.65 ± 0.13 eV for coated and non-coated solder joints, respectively. These values are indicative of the dominant diffusion mechanism during the experiment. It was discovered that the thermomigration driving force was as high as electromigration driving force.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
