Abstract
AbstractThe origin of the plasticity in bulk nanocrystalline metals have, to date, been attributed to the grain‐boundary‐mediated process, stress‐induced grain coalescence, dislocation plasticity, and/or twinning. Here we report a different mechanism—detwinning, which operates at low temperatures during the tensile deformation of an electrodeposited Cu with a high density of nanosized growth twins. Both three‐dimensional XRD microscopy using the Laue method with a submicron‐sized polychromatic beam and high‐energy XRD technique with a monochromatic beam provide the direct experimental evidences for low temperature detwinning of nanoscale twins.
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