Abstract
The microstructure vis-a-vis electrical transport behavior of Ag–Cd and Ag–Sn binary alloys in the temperature range 70–300 K has been studied. The 22.2 wt.% Cd and 29.4 wt.% Cd alloys were both found to have a single-phase structure made of solid solution of Ag. The lattice parameter however increased with increasing Cd content in the alloy. The microstructure of 17.7 wt.% Sn and 23.5 wt.% Sn alloys however is made of two phases Ag 4Sn and Ag 3Sn. The resistivity of Ag–Cd alloys increased with increasing Cd content and the temperature coefficient of resistivity (TCR) decreased to 1560 ppm K −1 for the 29.4 wt.% Cd alloy compared to 4100 ppm K −1 for pure Ag. The lowest TCR however was obtained for the 17.7 wt.% Sn alloy, 375 ppm K −1, which has a room temperature resistivity of 23.93 μΩ cm.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
