Low Temperature Chemical Vapor Deposition of ZrO2 on Si(100) Using Anhydrous Zirconium (IV) Nitrate

Abstract

Anhydrous zirconium(IV) nitrate was used as a volatile, carbon‐free precursor for the low pressure chemical vapor deposition of thin films on silicon (100) substrates. Depositions were performed at substrate temperatures between 300 and 500°C at total reactor pressures between 0.25 and 1.1 Torr. During deposition the carrier gas (flow rates = 20 or 100 sccm) was diverted through the precursor vessel which was maintained between 80 and 95°C. Under these conditions typical growth rates reached 10.0 nm/min. The polycrystalline films were predominantly monoclinic with compositions very near the ideal value. Cross‐sectional transmission electron microscopy and medium energy ion scattering established that an interfacial layer of separates the silicon substrate from the . Electrical measurements made on capacitors constructed of 58 nm thick films of with a platinum top electrode suggest that charge trapping occurs in the interfacial region. © 2000 The Electrochemical Society. All rights reserved.