Low-stress photosensitive polyimide suspended membrane for improved thermal isolation performance

Abstract

In this paper, we introduce a method of isolating thermal conduction from silicon substrate for accommodating thermal-sensitive micro-devices. This method lies in fabrication of a low-stress photosensitive polyimide (PSPI) suspension structure which has lower thermal conductivity than silicon. First, a PSPI layer was patterned on a silicon wafer and hard baked. Then, a cavity was etched from the backside of the silicon substrate to form a membrane or a bridge-shape PSPI structure. After releasing, a slight deformation of about 20 nm was observed in the suspended structures, suggesting ultralow residual stress which is essential for accommodating micro-devices. In order to investigate the thermal isolation performance of the suspended PSPI structures, micro Pirani vacuum gauges, which are thermal-sensitive, had been fabricated on the PSPI structures. The measurement results illustrated that the Pirani gauges worked as expected in the range from 1– 470 Pa. Moreover, the results of the Pirani gauges based on the membrane and bridge structures were comparable, indicating that the commonly used bridge-shape structure for further reducing thermal conduction was unnecessary. Due to the excellent thermal isolation performance of PSPI, the suspended PSPI membrane is promising to be an outstanding candidate for thermal isolation applications.