Abstract

Low metal–graphene contact resistance is important in making high-performance graphene devices. In this work, we demonstrate a lower specific contact resistivity of Au0.88Ge0.12/Ni/Au–graphene contact compared with Ti/Au and Ti/Pt/Au contacts. The rapid thermal annealing process was optimized to improve AuGe/Ni/Au contact resistance. Results reveal that both pre- and post-annealing processes are effective for reducing the contact resistance. The specific contact resistivity decreases from 2.5 × 10−4 to 7.8 × 10−5 Ω·cm2 by pre-annealing at 300 °C for one hour, and continues to decrease to 9.5 × 10−7 Ω·cm2 after post-annealing at 490 °C for 60 seconds. These approaches provide reliable means of lowering contact resistance.

Full Text
Published version (Free)

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call