Abstract
Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi solder alloys attract much attention from industries for flexible printed circuit board (FPCB) applications. Low melting temperatures of Sn-Bi solders avoid warpage wherein printed circuit board and electronic parts deform or deviate from the initial state due to their thermal mismatch during soldering. However, the addition of alloying elements and nanoparticles Sn-Bi solders improves the melting temperature, wettability, microstructure, and mechanical properties. Improving the brittleness of the eutectic Sn-58wt%Bi solder alloy by grain refinement of the Bi-phase becomes a hot topic. In this paper, literature studies about melting temperature, microstructure, inter-metallic thickness, and mechanical properties of Sn-Bi solder alloys upon alloying and nanoparticle addition are reviewed.
Highlights
In recent years, lead-free solders having high reliable metallurgical, mechanical, and electrical properties have been widely applied to consumer appliances and in industrial electronic products and automobile electronic products [1,2]
Fast data communication is required in 5G and IoT (Internet of Things) fields, which need the development of a system in the package (SiP), package on a package (PoP), Wafer level packaging (WLP), 2.5D &3D semiconductor package, system on chip (SOC), and System
The solidification interval is recommended to be
Summary
Lead-free solders having high reliable metallurgical, mechanical, and electrical properties have been widely applied to consumer appliances and in industrial electronic products and automobile electronic products [1,2]. In moisture sensitive packaging, defects such as delamination or pop-corning failure can be accentuated at a higher temperature [14]. To solve these problems, there is an increasing need for research on low melting point solders, such as Sn-Bi or Sn-In alloys [15]. The low melting point solder is suitable for temperature-sensitive fabrics [16] and flexible substrates [17]. Melting point solder is suitable for temperature-sensitive fabrics [16] and flexible substrates [17].
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