Abstract
With the development of high power, miniaturization and integration of electric devices, materials with effective electromagnetic interference (EMI) shielding and high thermal conductivity have become a hot topic. In this paper, cross-linked epoxy microspheres (CEMs) were firstly synthesized by precipitation polymerization, and then the CEMs were physically mixed with low melting point alloy (LMPA) SiBi58. Finally, the segregated epoxy/SnBi58 composites were prepared via hot-pressing technique. The SEM results showed that the aggregated SnBi58 particles formed a continuous network microstructure in the epoxy matrix, which was beneficial to the conduction of electrons and phonons. The epoxy/SnBi58 composites with 50 vol% alloy presented an outstanding electromagnetic interference (EMI) shielding effectiveness (SE) of 72 dB at 10.5 GHz and a satisfactory thermal conductivity of 1.6 W mK−1. Furthermore, this study demonstrated the potential application of LMPA in both thermal management and EMI shielding materials in future, and also widened the application of epoxy resin.
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