Abstract
Antenna-in-Package Technology (AiP) is a packaging solution technology for millimeter wave (mmWave) applications, such as automotive radar and 5G communication. AiP designers need to consider aspects such as antennas performance and interconnection loss between RF transceiver and antenna. The interconnection loss seriously affect the performance of the AiP. In this article, the conductor-backed coplanar waveguide (CBCPW) is used to evaluate the interconnection loss of three low Dk/Df substrate materials with different Dk/Df. The frequency band of CBCPW is 10 GHz to 90 GHz. The low Dk/Df substrate material can reduce the interconnection loss at 77 GHz by approximately 61.5%. In summary, designers can optimize AiP performance after reading this article.
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