Low loss cryogenic optical interconnects using photonic wire bonds

Abstract

Photonic technologies are being investigated to realize various next-generation devices, including quantum emitters, transducers and detectors, as well as classical devices, such as lasers, modulators, and detectors. A packaging approach that maintains high optical coupling efficiency over a wide temperature and broad wavelength range is needed for these devices and others. Photonic wire bonds (PWBs) may provide greater design flexibility, increased manufacturability, and higher tolerances to thermally driven misalignment at cryogenic temperatures. Freedom Photonics (a Luminar company) is developing high bandwidth optical interconnects for chip-to-chip or chip-to-fiber applications, utilizing PWBs to reduce optical loss at cryogenic temperatures.