Low-Leakage Double-Body MOSFET: A Promising Circuit-Level Technique for Deep-Submicron Analog Integrated Circuit Design

Abstract

Since the leakage currents are dramatically increasing while the MOS transistors scale down to deep-submicron processes, the [Formula: see text]–[Formula: see text] characteristic of the channel is varied unintentionally. As a result, the analog integrated circuit (IC) designs based on it (at above 100-nm technologies) will malfunction. In this paper, a novel low-leakage double-body MOSFET (LLDB-M), as a circuit-level scheme in answering to the need for the current-mode analog IC design in deep-submicron processes, is proposed. In this technique, the sub-threshold and gate-oxide tunneling leakage currents (as two major parts) are reduced via lowering the gate-source voltage and increasing the threshold voltage of the MOS transistor. An LLDB-M consists of two typical transistors — the first one is the main transistor and the latter implements the shift-voltage to reduce the gate-source voltage and floor of the channel leakage currents. The drain, gate, and body of the main transistor as well as the body and source of the second one, organize the terminals of an LLDB-M. The proposed LLDB-M transistors are replaced with large-leakage transistors in a translinear loop in the weak inversion region and then the commonly-used circuits such-as the current mirror, one-quadrant multiplier-divider (at both up-down and stack topologies), the true RMS-DC converter, and the log-domain low-pass-filter are designed. The effectiveness and performance of the proposed LLDB-M technique and circuits are evaluated using HSPICE software in 22-nm BSIM4 CMOS process and Cadence Virtuoso tool in 65-nm TSMC CMOS technology. Post-layout simulation results show that the proposed circuit-level method by considerably reducing leakage currents could ensure the effective function of the current-mode analog IC designs in deep-submicron technologies. Also, comprehensive simulations have been performed to prove the robustness and reliability of the proposed circuits against process, voltage and temperature (PVT) changes.