Abstract
The magnetron plasma etching of SiO2 and Si in fluorocarbon gas has been investigated. The plasma has high ionization degree, collisionless high density, and low energy ion flux (I∼1.0 mA/cm2, 30≲Ei ≲250 eV at 1 W/cm2) and a controllable etch uniformity. The bulk of the plasma supports an electric field which can be shaped to achieve normal ion bombardment of the etching surface. Good etching anisotropy, high SiO2/Si selectivity, and rates six times greater than conventional reactive ion etching were demonstrated.
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