Low-Dielectric Constant Nanoporous Epoxy for Electronic Packaging

Abstract

Epoxide functionalized poly(propylene carbonate) was included in an epoxy resin formulation and thermally decomposed to create nano-porous epoxy films. The dielectric constant of the porous epoxy was lower than the epoxy formulation control. The introduction of 30% porosity in the epoxy lowered the dielectric constant from 3.78 to 2.76. A post-porosity chemical treatment further lowered the dielectric constant. Hexamethyldisilazane was used to terminate the pore walls with the hydrophobic silane layer and reduce both the dielectric constant and tangent loss of the porous epoxy. Two different styrene maleic anhydride crosslinking agents were used in the epoxy formulation, SMA2000 and SMA4000. The effect of the maleic anhydride concentration within SMA on the electrical, mechanical, and thermal properties of porous epoxy film was evaluated. Epoxy films crosslinked with SMA2000 resulted in films with a higher dielectric constant compared to films prepared with SMA4000 due to higher mole fraction of maleic anhydride within SMA2000. However, SMA2000 cross-linked films yielded films with better mechanical and thermal properties. SMA2000 cross-linked films with 30% porosity had a coefficient of thermal expansion of 35.2 ppm/K and glass transition temperature of 143 °C.