Abstract
The aim of the present work is to develop a new type of flexible linear aliphatic alkoxy core bridged bisphenol cyanate ester (AECE) based POSS nanocomposites for low k applications. The POSS-AECE nanocomposites were developed by incorporating varying weight percentages (0, 5, and 10 wt %) of octakis (dimethylsiloxypropylglycidylether) silsesquioxane (OG-POSS) into cyanate esters. Data from thermal and dielectric studies imply that the POSS reinforced nanocomposite exhibits higher thermal stability and low dielectric value of k = 2.4 (10 wt% POSS-AECE4) compared than those of neat AECE. From the contact angle measurement, it is inferred that, the increase in the percentage incorporation of POSS in to AECE, the values of water contact angle was enhanced. Further, the value of surface free energy was lower when compared to that of neat AECE. The molecular level dispersion of POSS into AECE was ascertained from SEM and TEM analyses.
Highlights
High-performance dielectric materials have attracted much attention in worldwide, owing to their widespread applications in many rapidly developing fields such as electric power, microelectrics, informatics, etc. (Phang et al, 2009; Jang et al, 2010; Zhuo et al, 2012)
The hydrophobic polymers have been a topic of considerable interest owing to their attractive properties such as low surface energy, heat resistance, chemical inertness, and low dielectric constant
An introduction of Polyhedral oligomeric silsesquioxanes (POSS) in to polymers brings about significant improvements in their properties such as increased thermal stability, increased hardness and oxidative resistance, increased Tg, mechanical properties and decreased flammability and viscosity during processing, increase in hydrophobicity and wear resistance as well as decrease in friction on the surfaces of the POSS-based nanocomposites (Gonzalez et al, 2000; Devaux et al, 2002; Xu et al, 2002; Leu et al, 2003; Wu et al, 2007; Tang and Lewin, 2009; Cordes et al, 2010; Nagendiran et al, 2010; Devaraju et al, 2011, 2012; Kuo and Chang, 2011; Venkatesan et al, 2011, 2012; Chandramohan et al, 2012; Zhang and Müller, 2013)
Summary
High-performance dielectric materials have attracted much attention in worldwide, owing to their widespread applications in many rapidly developing fields such as electric power, microelectrics, informatics, etc. (Phang et al, 2009; Jang et al, 2010; Zhuo et al, 2012). High-performance dielectric materials have attracted much attention in worldwide, owing to their widespread applications in many rapidly developing fields such as electric power, microelectrics, informatics, etc. The hydrophobic polymers have been a topic of considerable interest owing to their attractive properties such as low surface energy, heat resistance, chemical inertness, and low dielectric constant. Low surface energy polymeric materials with good film-forming characteristics have attracted great interest because of their practical applications (Jeyaprakash et al, 2004; Yoshida et al, 2004; Qu et al, 2008). Most of the low surface energy polymeric materials that have been developed were based on flurorine- or silicon-containing polymers (Liang et al, 2011; Qu and Xin, 2011; Raza et al, 2012). An introduction of POSS in to polymers brings about significant improvements in their properties such as increased thermal stability, increased hardness and oxidative resistance, increased Tg, mechanical properties and decreased flammability and viscosity during processing, increase in hydrophobicity and wear resistance as well as decrease in friction on the surfaces of the POSS-based nanocomposites (Gonzalez et al, 2000; Devaux et al, 2002; Xu et al, 2002; Leu et al, 2003; Wu et al, 2007; Tang and Lewin, 2009; Cordes et al, 2010; Nagendiran et al, 2010; Devaraju et al, 2011, 2012; Kuo and Chang, 2011; Venkatesan et al, 2011, 2012; Chandramohan et al, 2012; Zhang and Müller, 2013)
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