Abstract
In this paper, low cycle fatigue studies on 99.3Sn–0.7Cu lead free solder was evaluated over a range of test temperatures (298, 348 and 398 K) and frequencies (10 −3–1 Hz), tested at four values of total strain range (2, 3.5, 5 and 7.5%). The fatigue performance of lead free 99.3Sn–0.7Cu solder was compared to 63Sn–37Pb solder. The effects of temperature and frequency on the low cycle fatigue life were discussed and were presented in Coffin–Manson and Morrow model relationships. Frequency modified Coffin–Manson and Morrow models were proposed for predicting the effect of frequency on low cycle fatigue life of 99.3Sn–0.7Cu solder alloy.
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