Low cycle fatigue crack initiation and propagation behavior of copper thin films used in electronic devices

Abstract

This paper presents the crack initiation and propagation behavior in 4-point bending low cycle fatigue for four kinds of copper thin films used in electronic devices at room and 353K. There was a distinct difference in cycles to crack depending on the fabrication process but not on surface roughness. The crack propagation rates depended on the fabrication process of the films but surface roughness. Raising the testing temperature accelealeted cycle to crack and cracks propagation rate.