Abstract
We have investigated plastic-type packages for active optical components in large core optical fiber applications. The chips are mounted on a ceramic submount and connected to a copper leadframe for electrical connection. VCSELs are used on the transmitter side. We have obtained excellent optical and electrical performance over a wide temperature range. Preliminary reliability tests show good results under temperature cycling conditions from -40/spl deg/C to 125/spl deg/C up to 500 cycles. On the receiver side, we have fabricated low capacitance photodiodes that are for large core optical fiber applications. Data rates up to 3.2 Gbps are achieved. The devices are well suited for applications which employ large core fiber such as plastic optical fiber (POF) or polymer cladded silica (PCS) fiber which is also well known as HCS/sup /spl reg// fiber.
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