Low cost multilayer metallization system for silicon solar cells

Abstract

One of the most important and costly aspects of solar cell manufacture, besides the silicon itself, is the way of contact metallization which provides electrically conducting paths on the surface of the cell. This work shows that the selective electrode-deposition process for nickel and electroplated copper can be used for solar cell metallization without sacrificing the efficiency but reducing the total price. The basic technological steps for the metallization process are discussed. Terrestrial solar cells with NiCu system are fabricated without compromising their electrical performance.