Low cost microwave thick film structures

Abstract

This paper examines the potential use of low cost materials and processes to produce thick film structures at low microwave frequencies. It examines empirically the upper frequency limits for the use of simple design techniques as a function of substrate thickness. It concludes that satisfactory results can be obtained using low cost methods up to about 12 GHz for 1 mm 96% alumina substrates and 16 GHz for 0.63 mm substrates. These are the most commonly available thick film substrate thicknesses. A low permittivity protective layer is desirable to maintain reliability.