Low cost high‐density multilayer circuits for MCM‐C

Abstract

For many years C‐MAC has used thick film technology in many electronic products for a large range of customer applications. A high degree of integration has been achievable, together with high reliability. Recently, however, new materials have been developed allowing for a further miniaturization. This paper reports on the development of a multilayer technology, based on the combination of state‐of‐the‐art Fodel® materials with Diffusion Patterning™ dielectric and and standard thick film materials. The combination of such materials allows for the manufacture of high density products, addressing the present and future needs of many new applications. Besides the process technology for manufacturing the substrate, different assembly technologies like dip and reflow soldering and chip and wire bonding have been successfully investigated. In comparison to LTCC, this technology offers the possibility of using only a few layers, therefore allowing for faster product development, more flexibility during manufacturing and optimisation of cost.