Abstract

Embedded copper mesh coatings with low sheet resistance and high transparency were formed using a low-cost Cu seed mesh obtained with a magnetron sputtering on a cracked template, and subsequent operations electroplating and embedding in a photocurable resin layer. The influence of the mesh size on the optoelectric characteristics and the electromagnetic shielding efficiency in a wide frequency range is considered. In optimizing the coating properties, a shielding efficiency of 49.38 dB at a frequency of 1 GHz, with integral optical transparency in the visible range of 84.3%, was obtained. Embedded Cu meshes have been shown to be highly bending stable and have excellent adhesion strength. The combination of properties and economic costs for the formation of coatings indicates their high prospects for practical use in shielding transparent objects, such as windows and computer monitors.

Highlights

  • The space around us is permeated with electromagnetic radiation of various frequencies

  • Significant progress has been made in developing shie particular, such lightweight, durable and affordable mate2 rofi1a7ls as graphene, MXene paper [1,2,3,4], aerogels [5,6,7,8] and polymer composite nraadnioonsahviegeattisonf,imlmobsile[a1n1d]sawteilltihte caomsmhiuenlicdaitniogns,cToVeafnfdicriaedniotbSroEadncaosttinlge, sWsi-Fthi, an 60 detec.veFolor ptheedco.rArectttohpeersataiomn eofthimighe,prtehceissioenmeleacttreorniiacldseavirceeso, hpuamqaunelifiensuthppeovrtisible ssfruyosimtteampbasr,laeassiftwiocerrlal dsaisooilnevmfoinirsmsgiaotnpio,rnwophbricolhetemicstiiosmnpo, lieftmissehcnritueecdlidamlitanoingelfyftetrchtariovnueslgyphpatrhroeeteuncsttesouofcbmhjedatecevtriisca:elssd, ispla cdoesmignpuantderteschannoldogimcalesaosluutiroinnsgbaisnedstornuthmemenptrsov, idgilnagzriandgio sehlieelmdinegnitnsvoarfiosups ecialefrtecq.uency ranges

  • The technological process of embedding a mesh into a photocurable resin layer contributes to a significant increase in the mechanical adh3esoifo1n7 properties of the coating

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Summary

Introduction

The space around us is permeated with electromagnetic radiation of various frequencies. In the range from tens of kHz to hundreds of GHz lie such essential technologies as performance properties as flexibility, transparency in various spectral and thickness, air permeability, etc. The technological process of embedding a mesh into a photocurable resin layer contributes to a significant increase in the mechanical adh3esoifo1n7 properties of the coating. We believe that in solving the problem of shielding transparent objects, these materials Fwroilml baencoemcoenoanmiecxpceolilnetnot favltieerwn,aCtiuveseteodmmicersoh aisnmd onraenpormofiestahbelse othbataninAegdsbeyedlimtheosgh-, wrahpihchy wmeeuthseoddsin, s[2in3c].eTthheesteechmneotlhoogdicsalspigroncifeiscsanotfleymlbimeditditnhge apmosessihbiilnittyo aopf hsocatolicnugratbhlee rteescihnnloalyoegrycoonvterriblaurtgees taoreaassigannidficinacnrteiansceretahseecionstthoef msuecchhamnaictaelriaadlsh.esion properties of the coating. 2. MaWteerbiaellsieavnedthMateitnhsoodlsving the problem of shielding transparent objects, these materials w2.1il.lMbeactoermiaelsan excellent alternative to micro and nanomeshes obtained by lithography methEogdgs, wsihnictee,theegsge ymoelkthoobdtsasinigendififrcoamntlay lfiomodit tmhearpkoest.siCbiolpitpyeorf ssucalplihnagtethpeetnetcahhnyodlroagtye o(CvuerSOla4r·g5eHa2rOe)a,ssaunlfduirniccraecaisde (tHhe2ScOos4)t,oefthsuacnholm(Cat2eHri5aOlsH. NPEeTggsuwbhsittreatperse5cu0rμsomr tihnidcket(aHili.-TFhi eInedgugswtrihailteFiplmrecLutrds.o, rStfeovretnhaegcer,aHckeerdtfotermdsphliartee, UwKas).prepared according to the following procedure: in a fresh chicken egg, the white was separated from the yolk, . We consider a cracked template with an almost twofold difference in the average cell size in our work

Magnetron Sputtering of Cu Layer and Obtained Cu Seed Mesh
Electroplating Copper on Cu Seed Mesh
Embedding Process Cu Meshes in Photocurable Resin Layer
Morphology Study Cu Meshes and Embedded Cu Meshes
Optoelectrical Properties Embedded Cu Meshes
Mechanical Properties of Cu Meshes and Embedded Cu Meshes
Shielding Properties of Embedded Cu Meshes
Morphology Study of Cu Meshes
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