Abstract
Back-contacted solar cells offer multiple advantages in regard of reducing module assembling costs and avoiding grid shadowing losses. The investigated emitter-wrap-through (EWT) device design has an electrical connection of the front emitter and the rear emitter grid in form of small holes drilled into the crystalline silicon wafer. The obtained cell structure is especially suitable for low-cost base material with small minority carrier diffusion lengths. Different industrially applicable solar cell manufacturing processes for EWT devices are described and compared. The latest experimental results are presented and interpreted; the photocurrent is found to be distinctly increased. The relation between open circuit voltage and rear side passivation is discussed based on two-dimensional (2-D) computer simulations.
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