Abstract

The recent advances of CMOS and SiGe process technologies have now made the design of lowcost highly integrated millimeter-wave radios possible in Silicon. In combination with an optimum organic Liquid Crystal Polymer packaging approach, this represents a unique opportunity to develop Gb/s radio that could address the increasing demand in term of data rate throughput of the emerging broadband wireless communication systems. In this paper we discuss the circuit and module challenges that will enable a successful deployment of 60GHz gigabits wireless systems.

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